Southeast Asia’s Largest Integrated Circuit Design Park to be Established in Malaysia
During the KL20 Summit 2024, Malaysian Prime Minister Anwar Ibrahim announced plans to build an Integrated Circuit (IC) Design Park in Puchong, Selangor by the Selangor Information Technology and Digital Economy Corp to promote original design manufacturing (ODM). The IC Design Park is expected to be the largest in Southeast Asia. This marks a significant development in the Anwar administration’s efforts to upstream Malaysia’s chip industry to higher segments of the semiconductor global value chain, one of the national strategic objectives of the New Industrial Master Plan 2030 and the establishment of the National Semiconductor Strategic Task Force (NSSTF).
During the Summit, four companies signed a letter of intent to be partner companies, namely Softbank subsidiary ARM Ltd, Phison Malaysia, SkyeChip Sdn Bhd, and Shenzhen Semiconductor Industry Association. The IC Design Park will be equipped with several public service tools and facilities, including affordable electronic design automation (EDA) tools, servers, multi-project wafer (MPW) services, and training programs, and is expected to begin operations in July 2024.